Exhibitor Products

Transecnd's MTE380T features the 112-layer 3D NAND flash, a high-speed PCI Express (PCIe) Gen4 x4 interface, and a powerful controller, achieving never-before-seen transfer speeds. In addition, the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend's MTE380T is also 100% chamber tested in-house for extended operating temperatures of -20℃~75℃.

Transcend also offers the MTE380T-I with wide temperature (-40℃~ 85℃) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.

Firmware Features

• Supports NVM command
• Dynamic thermal throttling
• Built-in LDPC ECC (Error Correction Code) functionality
• Advanced Global Wear-Leveling and Block management for reliability
• Advanced Garbage Collection
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• TRIM command for better performance
• NCQ command for better performance
• Compliant with TCG Opal specifications and IEEE 1667 standards
• Power-saving DevSleep (Device Sleep) mode (optional)

Hardware Features

• Compliant with NVM Express specification 1.4
• Compliant with PCI Express specification 4.0
• Space-saving M.2 form factor (30mm) – ideal for mobile computing devices
• PCIe Gen 4 x4 interface
• Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger
• Anti-sulfur technology implemented to prevent sulfurization in the environment
• Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
• Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available