Exhibitor Products

In addition, the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend's MTE460T is also 100% chamber tested in-house for extended operating temperatures of -20℃~75℃. Wide-temp capability (-40℃~85℃) can also be provided upon request, optimizing stability in extreme environments.

Firmware Features

• Supports NVM command
• Dynamic thermal throttling
• Built-in LDPC ECC (Error Correction Code) functionality
• Advanced Global Wear-Leveling and Block management for reliability
• Advanced Garbage Collection
• Static Data Refresh
• Early Move
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• TRIM command for better performance
• NCQ command for better performance
• Full drive encryption with Advanced Encryption Standard (AES) (optional)

Hardware Features

• Compliant with RoHS 2.0 standards
• Compliant with NVM Express specification 1.3
• Compliant with PCI Express specification 3.1
• Space-saving M.2 form factor (42mm) – ideal for mobile computing devices
• PCIe Gen 3 x2 interface
• Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger
• Anti-sulfur technology implemented to prevent sulfurization in the environment
• Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
• Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
• Supports Transcend Scope Pro software