Exhibitor Products

Transcend's MTE712P features the 112-layer 3D NAND flash and a PCI Express (PCIe) Gen4 x4 interface, achieving never-before-seen transfer speeds. Its built-in DRAM cache enables fast random read and write speeds, and improves drive endurance. In addition, the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend's MTE712P is also 100% chamber tested in-house for extended operating temperatures ranging from -40℃ to 85℃.

Firmware Features

• Supports NVM command
• Dynamic thermal throttling
• Built-in LDPC ECC (Error Correction Code) functionality
• Advanced Global Wear-Leveling and Block management for reliability
• Advanced Garbage Collection
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• TRIM command for better performance
• NCQ command for better performance
• Full drive encryption with Advanced Encryption Standard (AES)
• Compliant with TCG Opal specifications and IEEE 1667 standards

Hardware Features

• Compliant with RoHS 2.0 standards
• Compliant with NVM Express specification 1.4
• Compliant with PCI Express specification 4.0
• Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
• PCIe Gen 4 x4 interface
• DDR4 DRAM Cache embedded
• High-quality 3D NAND flash
• Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger
• Anti-sulfur technology implemented to prevent sulfurization in the environment
• Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
• Promised operational reliability in a wide temperature range (from -40°C to 85°C)