Exhibitor Products

Transcend's M.2 SSD MTS570P features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Applied with 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors, the MTS570P guarantees high reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and operating temperatures ranging from -40℃~85℃.

Firmware Features

• Dynamic thermal throttling
• Built-in LDPC ECC (Error Correction Code) functionality
• Advanced Global Wear-Leveling and Block management for reliability
• Advanced Garbage Collection
• Early Move
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• TRIM command for better performance
• NCQ command for better performance
• Full drive encryption with Advanced Encryption Standard (AES) (optional)
• Power-saving DevSleep (Device Sleep) mode (optional)

Hardware Features

• Compliant with RoHS 2.0 standards
• Space-saving M.2 form factor (42mm) – ideal for mobile computing devices
• DDR3 DRAM Cache embedded
• Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger
• Anti-sulfur technology implemented to prevent sulfurization in the environment
• Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
• Promised operational reliability in a wide temperature range (from -40°C to 85°C)