Exhibitor Products

Transcend's MTS970P features a SATA III 6Gb/s interface and the state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistor, the MTS970P is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and wide temperature capabilities ranging from -40℃~85℃.

Firmware Features

• Dynamic thermal throttling
• Built-in LDPC ECC (Error Correction Code) functionality
• Advanced Global Wear-Leveling and Block management for reliability
• Advanced Garbage Collection
• Static Data Refresh
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• TRIM command for better performance
• NCQ command for better performance
• Full drive encryption with Advanced Encryption Standard (AES) (optional)
• Power-saving DevSleep (Device Sleep) mode (optional)

Hardware Features

• Compliant with RoHS 2.0 standards
• Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
• DDR3 DRAM Cache embedded
• Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger
• Anti-sulfur technology implemented to prevent sulfurization in the environment
• Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
• Promised operational reliability in a wide temperature range (from -40°C to 85°C)